semiconductor substrate

Brand Name:PHOENIX

Model Number:1311

Place of Origin:CHINA

...packaging, is one of the bare chip mounting technologies. Semiconductor chips are transferred and mounted on printed circuit boards, and the electrical connection between the chip and the substrate is achieved by wire stitching, and covered with resin to ...

Brand Name:PHOENIX

Model Number:1917

Place of Origin:CHINA

...packaging, is one of the bare chip mounting technologies. Semiconductor chips are transferred and mounted on printed circuit boards, and the electrical connection between the chip and the substrate is achieved by wire stitching, and covered with resin to ...

Brand Name:PHOENIX

Model Number:13.5*11.2

Place of Origin:CHINA

...packaging, is one of the bare chip mounting technologies. Semiconductor chips are transferred and mounted on printed circuit boards, and the electrical connection between the chip and the substrate is achieved by wire stitching, and covered with resin to ...

Place of Origin:Guangdong, China

Brand Name:YUSH

..., ceramic, semiconductor chips, PCB, EMC wire frames, and other substrates with exceptional accuracy. Operation Procedures Wafer or Strip Tape mounting Dicing Cleaning UV separation Semi-Automatic Dicing System Description The ...

Place of Origin:Guangdong, China

Brand Name:YUSH

.... Through high-speed spindle rotation, it accurately cuts materials including glass, ceramic, semiconductor chips, PCB boards, EMC wire frames, and various other substrates. Operation Procedures Wafer or Strip Tape Mounting Dicing Cleaning UV Separation

Brand Name:ZG

Model Number:MS

Place of Origin:China

..., Wafer, Rings, Gas distribution plates, Nozzles Top nozzles or Baffles, Pedestal heaters, Cover plates RF windows, Crucibles Substrate Heat resistant base materials Key Features & Specifications: Utilizes hot pressing technology Up to diameter of

Brand Name:Antaeus

Model Number:AD-C005

Place of Origin:Hunan,China

... delays resulting from the length and capacitance of the interconnects on the packaging substrate can contribute significantly to the total propagation delay. To realize higher system performance, based on high-speed semiconductor LSI chips and a

Brand Name:Adcol

Model Number:TEC1-12706U

Place of Origin:China

...semiconductor pellets that have been “doped” so that one type of charge carrier—either positive or negative— carries the majority of current. The pairs of P/N pellets are configured so that they are connected electrically in series, but thermally in parallel. Metalized ceramic substrates ...

Brand Name:filamentlux

Model Number:FML-003

Place of Origin:China

...Substrate Sanan chip Mix gas cooling 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty G9 3W LED BULB Features: Full glass appearance which is same as a halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:filamentlux

Model Number:FML-003

Place of Origin:China

...Substrate Sanan chip Mix gas cooling 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty G9 3W LED BULB Features: Full glass appearance which is same as a halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:filamentlux

Model Number:FML-003

Place of Origin:China

...Substrate Sanan chip Mix gas cooling 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty G9 3W LED BULB Features: Full glass appearance which is same as a halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:filamentlux

Model Number:FML-001

Place of Origin:China

...Substrate Sanan chip Mix gas coolingt 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty G9 2W LED BULB Features: Full glass appearance which is same as a halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:China

Model Number:filamentlux

Place of Origin:FML-001

...Substrate Sanan chip Mix gas coolingt 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty R7S 4W LED BULB Description: Full glass appearance which is same like halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:China

Model Number:filamentlux

Place of Origin:FML-001

...Substrate Sanan chip Mix gas coolingt 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty R7S 4W LED BULB Description: Full glass appearance which is same like halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:China

Model Number:filamentlux

Place of Origin:FML-001

...Substrate Sanan chip Mix gas coolingt 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty R7S 7W LED BULB​ Description: Full glass appearance which is same like halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:China

Model Number:filamentlux

Place of Origin:FML-001

...Substrate Sanan chip Mix gas coolingt 320º beam Up to 70% energy savings 20w power consumption IP44 Ingress protection CE, RoHS, TUV, UL compliant 2 Year Warranty R7S 8W LED BULB Description: Full glass appearance which is same as a halogen bulb COB technology and get luminous flux up to 130lm/w+ Mix with Semiconductor

Brand Name:BonTek

Model Number:Sapphire (Al2O3)

Place of Origin:China

..., high strength, collision resistance, wear resistance, corrosion resistance and high temperature and high pressure resistance, biocompatibility, is an ideal substrate material for the production of semiconductor optoelectronic devices, the

Brand Name:BonTek

Model Number:Sapphire (Al2O3)

Place of Origin:China

..., high strength, collision resistance, wear resistance, corrosion resistance and high temperature and high pressure resistance, biocompatibility, is an ideal substrate material for the production of semiconductor optoelectronic devices, the

Brand Name:BonTek

Model Number:SAP

Place of Origin:China

...high quality sapphire substrate, which is a special kind of sapphire slice cut from high purity single crystal sapphire ingots. It is widely used in the fields of optoelectronics, semiconductor, precision optics, etc. Our sapphire wafer has excellent ...

Brand Name:BonTek

Model Number:SAP

Place of Origin:China

...Wafer is a type of semiconductor material made of sapphire, which has excellent optical, mechanical, and chemical properties. It is commonly used as the epitaxial layer for GaN-based materials and devices, and is also ...