memory modul

Model Number:AS0BC21-S30BB-7H

...memory module socket designed for horizontal mounting on PCBs. It features a compact design with a 0.5mm pitch and supports SMT processing with a peak temperature of 260C for 10-20 seconds. This socket is suitable for applications requiring high-density memory...

Model Number:AS0BC21-S40BB-7H

...row horizontal NGFF (Next Generation Form Factor) memory module socket designed for M.2 connectors. It features 67 contacts and 2 metal tabs, offering a compact and reliable solution for memory expansion in various computing applications.Product Attributes...

Brand Name:CANYI

Model Number:I2C IIC Interface EEPROM Memory

Place of Origin:Guangdong, China

AT24C256 I2C IIC Interface EEPROM Memory Module 8P Chip Power Supply Indicator Pull Up Resistor Dire Description: Onboard 8P-chip carrier, can support AT24C256 series chips; Pin power supply, on-board power indicator; on-board pull-up resistor for I2C ...

Brand Name:ZIITEK

Model Number:TIF™100-50-10F Series

Place of Origin:China

Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 The TIF™100-50-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ...

Brand Name:Ziitek

Model Number:TIF100-15-05S

Place of Origin:China

Compressible 1.5w / Mk Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ...

Brand Name:ZIITEK

Model Number:TIF100-40-12U

Place of Origin:China

China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ...

Brand Name:ZIITEK

Model Number:TIF100-02S

Place of Origin:China

Soft Compressible Siliocne Gray Thermally Gap Filler For RDRAM Memory Modules 1.5W/M-K 45 Shore00 Hardness The TIF®100-02S thermally conductive interface materials are applied to fill the air gaps between the ...

Brand Name:ZIITEK

Model Number:TIF100-25-11S

Place of Origin:China

TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal ...

Brand Name:ZIITEK

Model Number:TIF100-40-11S

Place of Origin:China

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-...

Brand Name:ZIITEK

Model Number:TIF100-14E

Place of Origin:China

Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ...

Brand Name:ZIITEK

Model Number:TIF™340

Place of Origin:China

High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules The TIF™340 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling par...

Brand Name:ZIITEK

Model Number:TIF8100

Place of Origin:China

5W / MK Conductivity Thermally Insulating Materials For RDRAM Memory Modules The TIF8100 use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become ...

Brand Name:Ziitek

Model Number:TIF700P Series

Place of Origin:China

Hot Selling Factory Customizable 7.5W/MK Thermal Pads For Memory Modules ​ The TIF™700P Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation ...

Brand Name:Ziitek

Model Number:TIS800K

Place of Origin:China

High Temperature Thermally Conductive Electrical Insulator Materials for Memory Modules Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. ...

Brand Name:Ziitek

Model Number:TIC800G

Place of Origin:China

Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in ...

Brand Name:ZIITEK

Model Number:TIF160-02F

Place of Origin:China

Gray White Compressible 1.5W/m-K Thermal Conductive Pad for Memory Modules Heat Sink Cooling Factory Profile Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand ...

Brand Name:ZIITEK

Model Number:TIF120-02S

Place of Origin:China

Soft and compressible Gray Compressible Thermal Conductive Silicone Pad for Memory Modules The TIF®120-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ...

Brand Name:ZIITEK

Model Number:TIF140-02S

Place of Origin:China

Manufature Gray Thermal Conductive Pad For RDRAM Memory Modules With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 ...

Brand Name:Ziitek

Model Number:TIF120-05S Series

Place of Origin:China

1.5W/mK 0.5-5.0mmT Blue Thermal Pad for Memory Modules and Thermal Gap Filler Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal ...

Brand Name:Ziitek

Model Number:TIF160-01U Series

Place of Origin:China

UL 1.5mmT Thermally Conductive Pad 1.5W/M-K For Memory Modules​ Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, ...