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All ic packaging process wholesalers & ic packaging process manufacturers come from members. We doesn't provide ic packaging process products or service, please contact them directly and verify their companies info carefully.
| Total 79568 products from ic packaging process Manufactures & Suppliers |
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Place of Origin:Hebei, China Brand Name:TONGBAO Product Description Automatic Corrugated Carton Box Making Machine Sun feeding unit 1. The feeding unit adopt SUN Extend--feed Complete OEM Feeder System From USA. Frequency conversion control the speed of feeding . 2.Wind energy can be adjusted to make ... |
Cangzhou Tongbao Carton Machinery Co.,Ltd.
Hebei |
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Place of Origin:Hebei, China Brand Name:TONGBAO Main Configuration: Semi-automatic gluer is new-type environmental equipment, mainly used in carton sticking, abandon the traditional copper stapling method, raised the productivity, and the product quality is good. Main machine frame: machine frame, ... |
Cangzhou Tongbao Carton Machinery Co.,Ltd.
Hebei |
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Brand Name:MW Model Number:no Place of Origin:CHINA Product Description: The Conveyor Parts product is a high-quality component designed to enhance the performance and durability of various conveying equipment. Manufactured from premium stainless steel, this product ensures exceptional resistance to ... |
Hangzhou Ocean Industry Co.,Ltd
Zhejiang |
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Brand Name:TJIN Place of Origin:China ...semiconductor IC packaging automation is an important part of the IC packaging process includes: loading, rail transport and slicing, preheating, slicing machine in the production process is mainly played by the role of automatic slicing and heating, the |
Guangdong Taijin Semiconductor Technology Co., Ltd
Guangdong |
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Place of Origin:CN Brand Name:Original Factory Model Number:NV6145CQ01 ...IC 6.2V To 24V 210mΩ GaNSlim™ Power IC In DPAK-4 Package High-performance GaN power IC featuring GaNSlim™ technology with wide operating voltage range and low on-resistance in compact DPAK-4 package. Key Specifications ParameterValue Operating Voltage 6.2V to 24V On-Resistance 210mΩ Technology GaNSlim™ Power IC Package DPAK-4 Company Advantages 15+ years of electronic components experience Secure ordering process... |
ShenZhen Mingjiada Electronics Co.,Ltd.
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Brand Name:Hiner-pack Model Number:HN21090 Place of Origin:Made In China ... is a kind of high-temperature resistant IC tray made of PES and the injection molding process. The JEDEC tray is a carrier used by semiconductor chip companies for packaging and baking tests of their chips. Because the tray can be in a 120℃-220℃ |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |
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Brand Name:Horexs Place of Origin:china ...IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless RF-Memory (DDR SDRAM)-Cell phone-Workstation, Server, Video Camera -Desktop PC, Note book PC,Wearable electronics;Semiconductor,IC package,IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Place of Origin:CN Brand Name:Original Factory Model Number:TLI4971-A040W2-US0001 ...IC Highly Accurate Coreless Magnetic Current Sensor In A 300mil DSO-16 Package Product Overview The TLI4971-A040W2-US0001 is a highly accurate coreless magnetic current sensor IC packaged in a 300mil DSO-16 format, designed for precise current measurement applications. MJD Advantage 15+ years experience in electronic components Secure ordering process... |
ShenZhen Mingjiada Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable ... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:Horexs Model Number:HRX Place of Origin:CHINA ...:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable ... |
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Brand Name:YAOAN Model Number:AF-50 Place of Origin:CHINA ...IC Packing Tube / Profile Extrusion Machine , IC Tubing Extrusion Line IC packaging tube/profile purposes: Integrated circuit resistor and capacitor and components are easy damaged in the transport process, IC packaging tube is the packing carrier for integrated circuit components put in and after that both ends sealed by sealing element, can protect components in the transport process from being damaged. Components in the packaging... |
YAOAN PLASTIC MACHINERY CO.,LTD
Guangdong |
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Brand Name:Hiner-pack Model Number:HN25004 Place of Origin:China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term... |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |