ic chip socket

Brand Name:Original Factory

Model Number:MT53E2G32D4DT-046 WT:A

Place of Origin:CN

... CMOS dynamic random access storage device with multi-chip package (MCP) and package overlay (PoP) design to save PCB space. LPDDR4 memory devices are ideal for handheld devices, ...

Brand Name:Original Factory

Model Number:MT62F1G64D4EK-023 AUT:B

Place of Origin:CN

... SDRAM Memory Chip for Mobile Devices and Artificial Intelligence (AI). Specification Of MT62F1G64D4EK-023 AUT:B Technology SDRAM - Mobile LPDDR5 Memory Size ...

Brand Name:Original Factory

Model Number:MT62F1536M32D4DS-023 AIT:C

Place of Origin:CN

Memory IC Chip MT62F1536M32D4DS-023 AIT:C Automotive 48Gbit LVSTL LPDDR5X Memory IC​ Product Description Of MT62F1536M32D4DS-023 AIT:C MT62F1536M32D4DS-023 AIT:C is Automotive 48Gbit LVSTL SDRAM - Mobile LPDDR5X Memory Chip. Specification Of ...

Brand Name:Original Factory

Model Number:MT53E256M32D2DS-046 AAT:B

Place of Origin:CN

...IC Chip MT53E256M32D2DS-046 AAT:B 8Gbit SDRAM Mobile LPDDR4 Memory IC Product Description Of MT53E256M32D2DS-046 AAT:B MT53E256M32D2DS-046 AAT:B LPDDR4 Memory optimized to solve power consumption problems in battery-powered applications. The memory device uses multi-chip...

Brand Name:Original Factory

Model Number:MT53E256M16D1FW-046 AAT:B

Place of Origin:CN

...IC Chip MT53E256M16D1FW-046 AAT:B 4Gbit Parallel SDRAM Mobile Memory IC Product Description Of MT53E256M16D1FW-046 AAT:B MT53E256M16D1FW-046 AAT:B Memory optimized to solve power consumption problems in battery-powered applications. The memory device uses multi-chip...

Brand Name:Original Factory

Model Number:MT53E128M32D2DS-046 AIT:A

Place of Origin:CN

... in battery-powered applications. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. Specification Of MT53E128M32D2DS-046 AIT:A Memory Size: 4 Gbit ...

Brand Name:Original Factory

Model Number:MT53E1G64D4SP-046 WT:C

Place of Origin:CN

... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 ...

Brand Name:Original Factory

Model Number:MT53E1G64D4NW-046 WT:C

Place of Origin:CN

...IC Chip MT53E1G64D4NW-046 WT:C 64 Gbit SDRAM LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E1G64D4NW-046 WT:C MT53E1G64D4NW-046 WT:C 64Gb low-power SDRAM (LPDDR4) is a high-speed CMOS dynamic random access memory. These memory devices are designed in multi-chip...

Brand Name:Original Factory

Model Number:MT53E1G32D2NP-053 RS WT:C

Place of Origin:CN

...IC Chip MT53E1G32D2NP-053 RS WT:C 32G DRAM LPDDR4 Memory IC Surface Mount Product Description Of MT53E1G32D2NP-053 RS WT:C MT53E1G32D2NP-053 RS WT:C is a high-speed CMOS dynamic random access storage device optimized to solve power consumption problems in battery-powered applications. These memory devices feature multi-chip...

Brand Name:Original Factory

Model Number:MT53E256M32D1KS-046 AIT:L

Place of Origin:CN

... mode is reduced to 1/5. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 ...

Brand Name:Original Factory

Model Number:MT53E256M32D1KS-046 WT:L

Place of Origin:CN

...-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 ...

Brand Name:Original Factory

Model Number:MT62F2G64D8CZ-023 AAT:C

Place of Origin:CN

Memory IC Chip MT62F2G64D8CZ-023 AAT:C 128Gbit Automotive LPDDR5 SDRAM Memory IC Product Description Of MT62F2G64D8CZ-023 AAT:C MT62F2G64D8CZ-023 AAT:C is 128Gbit Automotive LPDDR5 SDRAM Memory Chip for Mobile Devices and Artificial Intelligence (AI) are ...

Brand Name:Original Factory

Model Number:MT62F768M32D2DS-023 WT:C

Place of Origin:CN

Memory IC Chip MT62F768M32D2DS-023 WT:C 24Gbit LPDDR5 DRAM Memory IC TFBGA-315​ Product Description Of MT62F768M32D2DS-023 WT:C MT62F768M32D2DS-023 WT:C is 24Gbit Automotive LPDDR5X SDRAM Memory Chip for Mobile Devices and Artificial Intelligence (AI) . ...

Brand Name:Original Factory

Model Number:MT53E256M32D2DS-053 AIT:B

Place of Origin:CN

...multi-chip package (MCP) and Package stack (PoP) to save PCB space. Optimized to address power consumption in battery-powered applications, the ...

Brand Name:Original Factory

Model Number:CY62167G30-45ZXI

Place of Origin:CN

...-45ZXI Memory IC Chip 16Mbit Paralle Asynchronous SRAM Memory IC TSOP-48​ Product Description Of CY62167G30-45ZXI CY62167G30-45ZXI is a high performance CMOS Low Power (MoBL®) SRAM devices. The device supports single- and dual-chip enable options and ...

Brand Name:Original Factory

Model Number:CY62256NLL-55SNXIT

Place of Origin:CN

...IC Chip 256Kbit Static RAM Asynchronous Memory IC SOIC28 Product Description Of CY62256NLL-55SNXIT CY62256NLL-55SNXIT is a high performance CMOS static RAM Asynchronous Memory IC, organized as 32K words by 8 bits. Easy memory expansion is provided by an active LOW chip...

Brand Name:Original Factory

Model Number:W25N01GVZEIG

Place of Origin:CN

W25N01GVZEIG Memory IC Chip 3V 104MHz 1Gbit Serial SLC NAND Flash Memory IC Product Description Of W25N01GVZEIG W25N01GVZEIG (1G-bit) Serial SLC NAND Flash Memory provides a storage solution for systems with limited ...

Brand Name:Original Factory

Model Number:GD5F1GM7UEWIGR

Place of Origin:CN

GD5F1GM7UEWIGR Memory IC Chip 1Gbit SPI NAND Flash Memory IC WSON8 Data Storage IC Product Overview The GD5F1GM7UEWIGR is a 1Gbit SPI NAND Flash memory chip from the GD5F1GM7UE series, featuring a compact WSON-8 (6x5mm) package. This component delivers an ...

Brand Name:INFEINEON

Model Number:SAK-TC264D-40F200W BC

Place of Origin:Original Brand

Quick Reply Microcontroller Ic Chip Electronic Components SAK-TC264D-40F200N BC SAK-TC264D-40F200W BB Original integrated circuit : SAK-TC264D-40F200W BC is a microcontroller chip manufactured by Infineon Technologies AG, and it is a member of the TriCore...

Brand Name:Sireda

Model Number:Open Top

Place of Origin:China

... consistent performance during extended IC programming and testing cycles. Featuring: Customizable configurations to match your specific IC package (BGA, QFN, CSP, etc.) Robust construction for repeated insertions/extractions without wear Optimized for