bga ball grid array

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... Position BGA Rework Station Introduction: A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are ...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...BGA Touch Screen Rework Station with & CE Introduction: A BGA Rework Station is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...Touch Screen 3 Heating Zones Manual BGA Rework Station with & CE Introduction: A BGA Rework Station is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable devices. ...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

...BGA PCB'A FR4 PCB Circuit Board Double Side PCB Assembly Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the PCB'A. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

...BGA PCB'A FR4 PCB Circuit Board Double Side PCB Assembly Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the PCB'A. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs...

Brand Name:YDY

Model Number:Y-004

Place of Origin:China

Printed Circuit Boards Automated PCB Assembly Ball Grid Array Assembly Shenzhen YDY Technology Co., Ltd is to be the most professional PCBA/PCB manufacturer for prototyping and low-volume production to work with in the world. With more than a decade in ...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework. Key Components: Precision Heating System

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...BGA Rework Station 3 Heating Zones Manual For Electronic Assembly Products Description BGA Rework Station: Purpose: BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of

Brand Name:WDS

Model Number:WDS1800

Place of Origin:CHINA

...BGA balls. This feature eliminates the need for manual alignment, reducing the risk of errors and increasing efficiency. The HD monitor provides a clear view of the BGA balls, making it easy to monitor the rework process. With a maximum PCB size of 640*490mm, this BGA...

Brand Name:Original Factory

Model Number:XCZU28DR-L1FFVG1517I

Place of Origin:CN

...Gate Array BGA Package​ Product Description Of XCZU28DR-L1FFVG1517I XCZU28DR-L1FFVG1517I is Field Programmable Gate Array - Integrated Circuit Chip, the package is BGA. Specification Of XCZU28DR-L1FFVG1517I Part Number: XCZU28DR-L1FFVG1517I Package: BGA ...

Brand Name:Original Factory

Model Number:XCZU28DR-1FFVG1517E

Place of Origin:CN

... Gate Array, the package is BGA(Surface Mount). Specification Of XCZU28DR-1FFVG1517E Part Number: XCZU28DR-1FFVG1517E Package: BGA Mounting type: Surface Mount Power Supply(Max): 9.5V Category: Integrated Circuit Operation Temperature: 50 °C ~ 130 °C

Brand Name:Intel Corporation

Model Number:10M08SAU169A7G

...Array, PBGA169, 11 X 11 MM Organization 500 CLBS Package Body Material PLASTIC/EPOXY Package Code BGA Package Equivalence Code BGA169,13X13,32 Package Shape SQUARE Package Style GRID ARRAY Peak Reflow Temperature (Cel) NOT SPECIFIED Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY...

Brand Name:Intel

Model Number:EP4CE40F23I7N

...Description: The Altera EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-...

Brand Name:Original Factory

Model Number:10M50DAF484I6G

Place of Origin:CN

484-BGA Package 10M50DAF484I6G 28.9 Gbps NRZ Field Programmable Gate Array IC Product Description Of 10M50DAF484I6G 10M50DAF484I6G integrate a monolithic 14 nm FPGA fabric die with multiple high-speed transceiver tiles, all inside a single flip-chip BGA ...

Brand Name:Original Factory

Model Number:XCVC1502-2MSIVSVG

Place of Origin:CN

...Array BGA Package Product Description Of XCVC1502-2MSIVSVG XCVC1502-2MSIVSVG is built around an integrated shell composed of a programmable network on chip (NoC), which enables seamless memory-mapped access to the full height and width of the device. Specification Of XCVC1502-2MSIVSVG Part Number: XCVC1502-2MSIVSVG Package: BGA...

Brand Name:Original Factory

Model Number:XCVC1502-2MLEVBVA

Place of Origin:CN

... Logic Cells, AI Core Versal, the package is BGA. Specification Of XCVC1502-2MLEVBVA Part Number: XCVC1502-2MLEVBVA I/O: 114 – 530 Speed: 400MHz, 1GHz Serial Bandwidth (Full Duplex) - ...

Brand Name:Original Factory

Model Number:XCVC1502-2LSEVBVA

Place of Origin:CN

...DDR, DMA, PCIe. The package is BGA. Specification Of XCVC1502-2LSEVBVA Part Number: XCVC1502-2LSEVBVA Peripherals: DDR, DMA, PCIe Primary Attributes: Versal AI Core ...

Brand Name:Original Factory

Model Number:XCVC1502-2LLEVBVA

Place of Origin:CN

... is BGA, AI Core Versal. Specification Of XCVC1502-2LLEVBVA Part Number: XCVC1502-2LLEVBVA AIE-ML Shared Memory: 0 Mb System Logic ...