ball grid array

Brand Name:Original Factory

Model Number:MCIMX7S5EVM08SD

Place of Origin:CN

... ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: MCIMX7S5EVM08SD Number Of ...

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

... devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:Yizhuo

Model Number:Aluminum Pcb Board 01

Place of Origin:China

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:

Brand Name:PG

Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

Place of Origin:Shenzhen, China

.../write speeds of up to 400MB/s, making it ideal for applications requiring fast data access and reliable storage. Featuring a compact BGA (Ball Grid Array

Brand Name:PG

Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

Place of Origin:Shenzhen, China

... MultiMedia Card) is an embedded non-volatile storage solution. It integrates NAND flash chips and flash controllers into a small BGA (Ball Grid Array) package, providing devices with a highly integrated, low-cost, and

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work wit...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA chips, soldering new...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable ...

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

... Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing ...

Model Number:HS-700

Place of Origin:China

Brand Name:HSTECH

BGA Rework Station for Mobile Phone CCD Color Optical Alignment System 0.01mm Mounting Accuracy 1℃ Temperature Accuracy Product Overview The Mobile Phone BGA (Ball Grid Array) Rework Station is a high-performance, professional-grade repair solution ...

Model Number:HS-700

Brand Name:HSTECH

Place of Origin:China

... Introduction The Manual BGA Rework Station is an advanced, professional-grade repair equipment engineered for the precise removal, placement, and reballing of Ball Grid Array (BGA) components. Designed to meet the rigorous demands

Model Number:HS-520

Brand Name:HSTECH

Place of Origin:China

... and versatile rework solution designed for the efficient removal, placement, and soldering of Ball Grid Array (BGA) and other surface-mount components. Engineered for both professional repair shops and R&D laboratories, this equipment combines advanced

Brand Name:Original Factory

Model Number:MIMX8DX1AVOFZAC

Place of Origin:CN

... i.MX 8DualXPlus FBGA417 Applications Processors​ Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processors​. Specification Of MIMX8DX1AVOFZAC...

Brand Name:Original Factory

Model Number:MIMX8ML6CVNKZAB

Place of Origin:CN

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6CVNKZAB Core Type: 4 X Arm Cortex-A53 Operating ...

Brand Name:Original Factory

Model Number:MIMX8MN5DVPIZAA

Place of Origin:CN

...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number MIMX8MN5DVPIZAA USB Controllers 1 Serial...

Brand Name:Original Factory

Model Number:MIMX8MN5CVPIZAA

Place of Origin:CN

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC​ Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applications Processors. 1x Gigabit Ethernet...

Brand Name:Original Factory

Model Number:MIMX8MN1DVTJZAA

Place of Origin:CN

... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display features MIPI-CSI,MIPI-DSI Audio Specific Modules 8-ch ...

Brand Name:Original Factory

Model Number:MCIMX7S3DVK08SD

Place of Origin:CN

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 3.3V Operating Temperature 0°C ~ ...