3.0 W/MK 2.0mmT Soft Compressible Thermal Conductive Gap Pad For IT Infrastructure
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3.0 W/mK ,2.0mmT Soft and compressible thermal conductive gap pad for IT infrastructure The TIF180-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure
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...thermal gap pad 1.8 W/MK 25shore00 For IT infrastructure Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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