ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
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Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Small BGA Double Sided PCB Board Prototype ENEPIG PCB Green Solder Mask 7mil
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Small BGA Double Sided PCB Board Prototype ENEPIG PCB Green Solder Mask 7mil Double Sided PCB Double Sided ENEPIG PCB Small BGA And Impedance Control Green Solder Mask Double Sided ENEPIG PCB HSX Circuit covers a total production area of 10,000 square ......
Huashengxin Circuit Limited
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Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD
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High Definition Industrial Touch Screen BGA rework station HS-700
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...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA......
Shenzhen Hansome Technology Co., Ltd.
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BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable
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... of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example) Yellow and white core plate divided core material, usually ......
Shenzhen Xinchenger Electronic Co.,Ltd
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0.8mm DiClad 870 RF PCB Dual Layer Rigid Boards With ENEPIG
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Introducing the newly shipped RF PCB.Which is built is built on 31mil rogers DiClad 870 substrates. Designed with a focus on achieving lower dielectric constants, the DiClad 870 PCB offers exceptional electrical properties for a wide range of applications......
Bicheng Electronics Technology Co., Ltd
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
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... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Shenzhen Bicheng Electronics Technology Co., Ltd
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Electricity Circuit Component BOM Turnkey PCB Assembly BGA X Ray Inspection
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... BGA X Ray Inspection The printed circuit board is abbreviated as PCB, also known as printed circuit board, printed circuit board, etc. It is a circuit board that forms point-to-point connections and printed components on a common substrate according......
Chengdu Cesgate Technology Co., Ltd
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Cycling Rapid Rate TSA BGA Thermal Shock Chamber Testing
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... components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials. Characteristics: 1. Short...
BOTO GROUP LTD
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6oz Pcb Smt Assembly Fr4 Hasl Qfn Bga Dip Rigid
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...BGA DIP Rigid PCB Assembly PCB SMT Assembly Introduction Haina Lean Technology CO., LTD is our factory. We build amazing electronics. From prototype to production, we are entrusted to be their electronic manufacturing partner by companies small and large around the world. PCBA CAPABILITIES Layers 1 - 46 L Substrate......
Beijing Haina Lean Technology Co., Ltd
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