UL Recognized 1.0mmT Thermal Gap Pad For Audio Video Components 2.5g/Cc 18 Shore 00
![]() |
... additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling TIF100-18-01US-Specification-sheet.pdf Features >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
3.0mmT Thermal Gap Pad 1.8 W/MK 25shore00 For IT Infrastructure
![]() |
...0mmT high cost-effective thermal gap pad 1.8 W/MK 25shore00 For IT infrastructure Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
TIF200-30-25S Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
![]() |
... gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling....
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
3W / M * K Thermal Gap Pads Conductive Pad For Lithium Battery Electric Vehicle
![]() |
...Thermal Gap Pads Conductive Pad for Lithium Battery Electric Vehicle Discription of thermal conductive pad : The thermal conductive pad is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and thermal conductivity effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. thermal...
Trumony Aluminum Limited
|
Grey Thermally Conductive Gap Filler Pads Electronic Thermal Gap Pad Material
![]() |
Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting...
ZSUN CHIPS CO., LTD
|
Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
![]() |
... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
|
Thermally Conductive Material Thermal Conductive Silicone Gap Pad
![]() |
... thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not...
Adcol Electronics (Guangzhou) Co., Ltd.
|
Green Rubber Heat Thermal Conductive Pad Heatproof Weather Resistant
![]() |
Green thermal rubber pad Thermal Conductive Pad With 5.0W/m.K For Power Supplies thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Dark green Visual Thickness(mm) 1.0~6.0 ......
Shenzhen Aochuan Technology Co., Ltd
|
Thermal Conductive Silicone Pad Insulating Pad for CPU Electronics
![]() |
...Thermal Heat Sink Pad is engineered with a high-volume resistivity of 1x10^13 Ω·cm, making it an ideal choice for electrical insulation applications. This ensures that your electronic components remain safe and protected from electrical currents that could potentially damage them. With a 100% elongation factor built into the design, the Silica Gel Thermal gap......
Shenzhen Linmao Electronic Material Co.,Ltd.
|
Flexible Soft Thermal Pad Thermal Conductive Silicone Pad ISO
![]() |
...Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility. The thermal......
Shenzhen Antac Technology Limited
|