Tailored Copper Thick Green Solder Multi Layer PCB Board Higher Reliability

10 layer FR4 Green Solder Multi-layer PCB Board PCB

FR4 Multilayer PCB board is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.

Advantages of Multilayer PCB:

1.Structural Feature: Multiple copper circuit layers separated by insulating prepreg, bonded into an integrated rigid/flexible board via high-temperature lamination.

2.Interconnection Method: Uses through, blind, or buried vias to realize electrical connection between internal and external circuit layers.

3.Performance Trait: Excellent impedance control, low signal crosstalk, strong anti-interference ability, suitable for high-frequency and high-speed signal transmission.

4.Design Advantage: High-density wiring in a small footprint, supports complex multi-functional circuit layouts and product miniaturization.

5.Application Adaptability: Compatible with harsh working environments; widely used in high-end electronics like 5G equipment, automotive electronics and aerospace devices.

Why choose our multilayer printed circuit boards?

✔ 30 Years Expertise in PCB Manufacturing
✔ ISO 9001, ROHS, and ISO /TS16949 Certified
✔ Support customized services
✔ Professional Engineering Support (DFM, impedance simulation)
✔ Global Shipping (DHL, FedEx, UPS) – Delivered to USA, Germany, UK, Japan, Australia, etc.

Manufacturing Process of Multilayer PCBs
1. Inner-layer Core Fabrication: Transfer circuit patterns onto copper-clad laminates, etch excess copper, and strip photoresist to form inner circuits.
2. AOI Inspection: Check inner boards for defects like open/short circuits with automated optical inspection.
3. Layer Stacking & Lamination: Alternate inner cores with prepreg, then press under high temperature and pressure to bond into an integrated block.
4. Drilling: Drill through, blind or buried vias at designated positions for interlayer connections.
5. Plating: Plate copper on via walls and board surfaces to ensure electrical conductivity between layers.
6. Outer-layer Processing: Repeat pattern transfer and etching to create outer circuit traces.
7. Surface Finishing: Apply HASL, ENIG or immersion tin to protect copper and improve solderability.
8. Final Testing & Shaping: Conduct electrical tests, trim to size, and perform quality checks before packaging.

Factory showcase

PCB Quality Testing

Certificates and Honors

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.

As a professional supplier of customized boards, we work closely with our clients, leveraging our strengths in processes and technologies based on their design files to create high-performance, high-quality customized boards that support their product innovation and upgrades.Our company has two production bases in Dongguan andJiangxi, covering an area of 205000 square meters with a comprehensive monthly production capacity of 200000 square meters. The company's products are widely used in computer peripherals, communication, power supply, medical, automotive electronics, household appliances and other fields.

Our company advocate integrity, win-win and pioneering business philosophy, and put into practice the work style of "pragmatism, hard work and responsibility" to create a good corporate environment. Based on a new management model, advanced technology and equipment and good product quality, We always adhere to the corporate spirit of customer first and people-oriented.