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High Thermal Conductivity Heat Dissipation Thermal Conductive Grease for CPU Heatsink Cooling

Categories Thermal Conductive Grease
Brand Name: Ziitek
Model Number: TIG780-38
Certification: RoHs
Place of Origin: China
MOQ: 1KG
Supply Ability: 100KG/Days
Delivery Time: 3-5 work days
Packaging Details: 1KG/CAN
Product Name: TIG780-38
Color: Gray
Evaporation: 0.15% / 200℃@24hrs
Specific Gravity: 2.5 g/cm3
Thermal Conductivity: 3.8 W/mK
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    High Thermal Conductivity Heat Dissipation Thermal Conductive Grease for CPU Heatsink Cooling

    High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling


    The TIG™780-38 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.


    TIG780-38 Series Datasheet-(E)-REV01.pdf



    Applications lnclude

    Semiconductor cases and heat sinks
    Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
    CPUs and GPUs
    Automatic dispensing and screen-printing
    Mobile, desktop
    Engine and transmission control modules
    Memory modules
    Power conversion equipment
    Power supplies and UPS
    Power semiconductors
    Custom ASICS Chips
    Integrated Gate Bipolar Transistors (IGBT)
    Between any heat generating semiconductor and heat sink
    Custom power modules
    Telecommunications and automotive electronics

    Features:


    Low thermal resistance
    One component paste like interface material, never dry
    Thermal compound formulated to maximize the heat transfer
    Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures
    Non-toxic and environmentally safe
    Silicone-based materials conduct heat between a hot component and a heat sink or enclosure
    Fills interface variable tolerances in electronics assemblies and heat sink applications
    Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
    Thermally stable and require virtually no compressive force to deform under typical assembly pressures
    Supports high power applications requiring material with minimum bond line thickness and high conductivity
    Ideal for rework and field repair situations
    Low bleed and evaporation

    Typical Properties of TIG™780-38 Series

    ProductNameTIG™780-38Test Method
    ColorGrayVisual
    Construction &
    Compostion
    Metal oxide filled silicone oil
    Viscosity1800K cps @.25℃Brookfield RVF,#7
    Specific Gravity2.5 g/cm3
    Continuous Use Temp-49℉ to 392℉ / -45℃ to 200℃*****
    Evaporation
    0.15% / 200℃@24hrs
    *****
    Thermal Conductivity3.8 W/mKASTM D5470
    Thermal lmpedance0.04℃-in²/W @ 50 psi(344 KPa)ASTM D5469

    Package:
    TIG™780 Series is available in 1kg(pint container),3kg(quart container),and 10kg(gallon container)or custom packaged in syringes for automated applications.



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