Sign In | Join Free | My spintoband.com
spintoband.com
Products
Search by Category
Wholesale Marketplace
Home > Stencils >

Packaging Elite FC

Country/Region china
Company Millennium Microtech (Shanghai) Co., LTD
Categories Fiber Optic Adaptor
Telephone +44 1450 373 919
ICP License Issued by the Chinese Ministry
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Packaging Elite FC

    Elite FC

    Release date:2015-07-09

    Technical Overview

    The EliteFCTM process utilizes the Elite Ni/Au process for the Under Bump Metal (UBM). It is a low cost, highly reliable, high volume flip chip process. In this process, solder paste is applied to the wafers using a stencil technology after the wafers complete the e-less Ni UBM.

    The EliteFCTM process places solder bumps directly on the device I/O’s and is well suited for product that has finer pitch requirements than the EliteCSPTM process.

    Shared:
    Quality Packaging Elite FC for sale
    Send your message to this supplier
     
    *From:
    *To: Millennium Microtech (Shanghai) Co., LTD
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0

    Home| Products| Suppliers| Quality Suppliers| Site Map |About Us |Contact Us |Help |关于我们 |联系我们

    Copyright © 2009 - 2021 spintoband.com. All rights reserved.