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Packaging Elite FC

Country/Region china
Company Millennium Microtech (Shanghai) Co., LTD
Categories Fiber Optic Adaptor
Telephone +44 1450 373 919
ICP License Issued by the Chinese Ministry
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    Packaging Elite FC

    Elite FC

    Release date:2015-07-09

    Technical Overview

    The EliteFCTM process utilizes the Elite Ni/Au process for the Under Bump Metal (UBM). It is a low cost, highly reliable, high volume flip chip process. In this process, solder paste is applied to the wafers using a stencil technology after the wafers complete the e-less Ni UBM.

    The EliteFCTM process places solder bumps directly on the device I/O’s and is well suited for product that has finer pitch requirements than the EliteCSPTM process.

    Quality Packaging Elite FC for sale
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